Revealing the Dynamics of the Thermal Reaction between Copper and Mixed Halide Perovskite Solar Cells
- Lim, Jihoo; Choi, Eunyoung; Kim, Moonyong; Lee, Minwoo; Chen, Daniel; Green, Martin A.; Seidel, Jan; Kim, Changheon; Park, Jongsung; Hao, Xiaojing; Yun, Jae Sung
- Issue Date
- AMER CHEMICAL SOC
- copper; halide perovskite; degradation; grain boundaries; Kelvin probe force microscopy
- ACS APPLIED MATERIALS & INTERFACES, v.14, no.18, pp.20866 - 20874
- Journal Title
- ACS APPLIED MATERIALS & INTERFACES
- Start Page
- End Page
- Copper (Cu) is present not only in the electrode for inverted-structure halide perovskite solar cells (PSCs) but also in transport layers such as copper iodide (Cup, copper thiocyanate (CuSCN), and copper phthalocyanine (CuPc) alternatives to spiro-OMeTAD due to their improved thermal stability. While Cu or Cu-incorporated materials have been effectively utilized in halide perovskites, there is a lack of thorough investigation on the direct reaction between Cu and a perovskite under thermal stress. In this study, we investigated the thermal reaction between Cu and a perovskite as well as the degradation mechanism by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and Kelvin probe force microscopy (KPFM). The results show that high temperatures of 100 degrees C induce Cu to be incorporated into the perovskite lattice by forming "Cu-rich yet organic A-site-poor" perovskites, (Cu(x)A(1-x))PbX3 , near the grain boundaries, which result in device performance degradation.
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- 융합기술공과대학 > Department of Energy Engineering > Journal Articles
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