Cited 24 time in
Discontinuous precipitation at the deformation band in copper alloy
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Han, Seung Zeon | - |
| dc.contributor.author | Ahn, Jee Hyuk | - |
| dc.contributor.author | You, Young Soo | - |
| dc.contributor.author | Lee, Jehyun | - |
| dc.contributor.author | Goto, Masahiro | - |
| dc.contributor.author | Kim, Kwangho | - |
| dc.contributor.author | Kim, Sangshik | - |
| dc.date.accessioned | 2022-12-26T17:18:29Z | - |
| dc.date.available | 2022-12-26T17:18:29Z | - |
| dc.date.issued | 2018-01 | - |
| dc.identifier.issn | 1598-9623 | - |
| dc.identifier.issn | 2005-4149 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/12048 | - |
| dc.description.abstract | The Cu-Ni-Si alloy is known as a precipitation hardening alloy, where the Ni2Si intermetallic compound is precipitated in the matrix during aging. There are two types of precipitation of Ni2Si: continuous and discontinuous cellular. The discontinuous cellular precipitation is generally initiated at interfaces especially grain boundaries in the matrix. To observe the grain boundary effect on the discontinuous precipitation, a large-grained Cu-Ni-Si-Ti alloy was intentionally fabricated by unidirectional solidification and plastically deformed by groove rolling. While discontinuous cellular precipitation has been generally known to occur only at the high angled grain boundaries in the alloys, we found that it was also generated inside the grains, at the deformation bands formed by plastic deformation. | - |
| dc.format.extent | 5 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | KOREAN INST METALS MATERIALS | - |
| dc.title | Discontinuous precipitation at the deformation band in copper alloy | - |
| dc.type | Article | - |
| dc.publisher.location | 대한민국 | - |
| dc.identifier.doi | 10.1007/s12540-017-6626-8 | - |
| dc.identifier.scopusid | 2-s2.0-85040103020 | - |
| dc.identifier.wosid | 000419534500003 | - |
| dc.identifier.bibliographicCitation | METALS AND MATERIALS INTERNATIONAL, v.24, no.1, pp 23 - 27 | - |
| dc.citation.title | METALS AND MATERIALS INTERNATIONAL | - |
| dc.citation.volume | 24 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 23 | - |
| dc.citation.endPage | 27 | - |
| dc.type.docType | Article | - |
| dc.identifier.kciid | ART002304343 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
| dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
| dc.subject.keywordPlus | ELECTRICAL-PROPERTIES | - |
| dc.subject.keywordPlus | CRYSTAL-GROWTH | - |
| dc.subject.keywordPlus | TI ADDITION | - |
| dc.subject.keywordPlus | CU ALLOY | - |
| dc.subject.keywordPlus | MICROSTRUCTURE | - |
| dc.subject.keywordPlus | CONDUCTIVITY | - |
| dc.subject.keywordPlus | TENSILE | - |
| dc.subject.keywordAuthor | Ni2Si | - |
| dc.subject.keywordAuthor | intermetallics | - |
| dc.subject.keywordAuthor | aging | - |
| dc.subject.keywordAuthor | discontinuous cellular precipitation | - |
| dc.subject.keywordAuthor | shear band | - |
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