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A low knee voltage and high breakdown voltage of 4H-SiC TSBS employing poly-Si/Ni Schottky scheme
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Dong Young | - |
| dc.contributor.author | Seok, Ogyun | - |
| dc.contributor.author | Park, Himchan | - |
| dc.contributor.author | Bahng, Wook | - |
| dc.contributor.author | Kim, Hyoung Woo | - |
| dc.contributor.author | Park, Ki Cheol | - |
| dc.date.accessioned | 2022-12-26T17:17:14Z | - |
| dc.date.available | 2022-12-26T17:17:14Z | - |
| dc.date.issued | 2018-02 | - |
| dc.identifier.issn | 0038-1101 | - |
| dc.identifier.issn | 1879-2405 | - |
| dc.identifier.uri | https://scholarworks.gnu.ac.kr/handle/sw.gnu/11952 | - |
| dc.description.abstract | We report a low knee voltage and high breakdown voltage 4H-SiC TSBS employing poly-Si/Ni dual Schottky contacts. A knee voltage was significantly improved from 0.75 to 0.48 V by utilizing an alternative low workfunction material of poly-Si as an anode electrode. Also, reverse breakdown voltage was successfully improved from 901 to 1154 V due to a shrunk low-work-function Schottky region by a proposed self-align etching process between poly-Si and SiC. SiC TSBS with poly-Si/Ni dual Schottky scheme is a suitable structure for high-efficiency rectification and high-voltage blocking operation. | - |
| dc.format.extent | 4 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
| dc.title | A low knee voltage and high breakdown voltage of 4H-SiC TSBS employing poly-Si/Ni Schottky scheme | - |
| dc.type | Article | - |
| dc.publisher.location | 영국 | - |
| dc.identifier.doi | 10.1016/j.sse.2017.10.009 | - |
| dc.identifier.scopusid | 2-s2.0-85031687849 | - |
| dc.identifier.wosid | 000425490800003 | - |
| dc.identifier.bibliographicCitation | SOLID-STATE ELECTRONICS, v.140, pp 8 - 11 | - |
| dc.citation.title | SOLID-STATE ELECTRONICS | - |
| dc.citation.volume | 140 | - |
| dc.citation.startPage | 8 | - |
| dc.citation.endPage | 11 | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | sci | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
| dc.subject.keywordPlus | DIODES | - |
| dc.subject.keywordAuthor | SiC | - |
| dc.subject.keywordAuthor | Trench | - |
| dc.subject.keywordAuthor | Schottky | - |
| dc.subject.keywordAuthor | SBD | - |
| dc.subject.keywordAuthor | TSBS | - |
| dc.subject.keywordAuthor | Poly-Si | - |
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