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Understanding the role of additional Cu intercalation in electronic and thermal properties of p-type Cu2.9Te2-incorporated Bi0.5Sb1.5Te3 thermoelectric alloys

Park, Hyunjin; Yahyaoglu, Mujde; Kim, Sang-il; Hwang, Seong-Mee; Saglik, Kivanc; Oztulum, Sefa; Kim, Se Yun; Lee, Kyu Hyoung; Aydemir, Umut; Kim, Hyun-Sik

ArticleIssue Date2024CitationJournal of Alloys and Compounds, v.995PublisherElsevier BV
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