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SCIESCOPUS
Electronic, Thermal, and Thermoelectric Transport Properties of ReSe2 and Re2Te5open access

Bang, Joonho; Park, Okmin; Kim, Hyun-Sik; Hwang, Seung-Mee; Lee, Se Woong; Park, Sang Jeoung; Kim, Sang-il

ArticleIssue Date2023CitationInternational Journal of Energy Research, v.2023PublisherJohn Wiley & Sons Inc.
SCIESCOPUS
Evolution of electrical transport properties in FeTe2-CoTe2 solid solution system for optimum thermoelectric performance

Park, Sang Jeong; Kwak, Hangil; Kim, Hyun-Sik; Bang, Joonho; Park, Hyunjin; Park, Okmin; Kim, TaeWan; Kim, Sang-il

ArticleIssue Date2023CitationJournal of Alloys and Compounds, v.960PublisherElsevier BV
SCIESCOPUS
High-temperature planar heating elements using RuO2 nanosheetsopen access

Lee, Chang Soo; Kim, Jinhong; Kim, Doyoon; Ko, Dong-Su; Kim, Hajin; Koh, Haengdeog; Bae, Minjong; Sohn, Hiesang; Mizusaki, Soichiro; Jung, Changhoon, et al.

ArticleIssue Date2024CitationCeramics International, v.50, no.12, pp 22123 - 22128PublisherPergamon Press Ltd.
SCIESCOPUS
Phase formation behavior and electronic transport properties of HfSe2-HfTe2 solid solution system

Bang, Joonho; Kim, Hyun-Sik; Kim, Dong Ho; Lee, Se Woong; Park, Okmin; Kim, Sang-il

ArticleIssue Date2022CitationJournal of Alloys and Compounds, v.920PublisherElsevier BV
SCIESCOPUS
Thermoelectric Properties of Cu2Te Nanoparticle Incorporated N-Type Bi2Te2.7Se0.3open access

Jung, Yong-Jae; Kim, Hyun-Sik; Won, Jong Ho; Kim, Minkyung; Kang, Minji; Jang, Eun Young; Nguyen Vu Binh; Kim, Sang-il; Moon, Kyoung-Seok; Roh, Jong Wook, et al.

ArticleIssue Date2022CitationMATERIALS, v.15, no.6PublisherMDPI
SCIESCOPUSKCI
Thermoelectric Transport Properties of Co<sub>0.5</sub>Fe<sub>0.5</sub>Se<sub>2</sub>, Co<sub>0.5</sub>Fe<sub>0.5</sub>Te<sub>2</sub>, and Their Solid-Solution Compositions

Park, Sang Jeong; Kim, Seyun; Park, Okmin; Lee, Se Woong; Kim, Sang-il

ArticleIssue Date2024CitationELECTRONIC MATERIALS LETTERS, v.20, no.4, pp 432 - 439PublisherKOREAN INST METALS MATERIALS
SCIESCOPUS
Understanding the role of additional Cu intercalation in electronic and thermal properties of p-type Cu2.9Te2-incorporated Bi0.5Sb1.5Te3 thermoelectric alloys

Park, Hyunjin; Yahyaoglu, Mujde; Kim, Sang-il; Hwang, Seong-Mee; Saglik, Kivanc; Oztulum, Sefa; Kim, Se Yun; Lee, Kyu Hyoung; Aydemir, Umut; Kim, Hyun-Sik

ArticleIssue Date2024CitationJournal of Alloys and Compounds, v.995PublisherElsevier BV
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