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Experimental and numerical study of solder bumps impact on the underfill fluid flow under electrohydrodynamic effect

Hassan, Rizwan Ul; Khalil, Shaheer Mohiuddin; Khan, Saeed Ahmed; Ali, Shahzaib; Hussain, Hamza; Cho, Dae-Hyun; Byun, Doyoung

ArticleIssue Date2023CitationPhysica Scripta, v.98, no.11PublisherRoyal Swedish Academy of Sciences
SCIESCOPUS
Void-less metallization of high aspect ratio through glass via using electrohydrodynamic drop-on-demand printing

Hussain, Hamza; Khalil, Shaheer Mohiuddin; Cho, Dae-Hyun; Byun, Doyoung

ArticleIssue Date2024CitationJournal of Manufacturing Processes, v.131, pp 2029 - 2036PublisherElsevier Ltd
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