Kim, Sedong; Tserengombo, Baasandulam; Choi, Soon-Ho; Noh, Jungpil; Huh, Sunchul; Choi, Byeongkeun; Chung, Hanshik; Kim, Junhyo; Jeong, Hyomin
ArticleIssue Date2019CitationAPPLIED THERMAL ENGINEERING, v.146, pp 346 - 355PublisherPERGAMON-ELSEVIER SCIENCE LTD