Jung, E.M.; Tentzeris, M.M.; Cui, Y.; Lin, T.-H.; He, X.; Eid, A.; Hester, J.G.D.; Abowd, G.D.; Starner, T.E.; Lee, W.-S.
ArticleIssue Date2020CitationIEEE Microwave and Wireless Components Letters, v.30, no.2, pp 201 - 204PublisherInstitute of Electrical and Electronics Engineers Inc.
